Core Product Introduction Of ESC Electrostatic Chuck
2026-01-23
The ESC Electrostatic Chuck is a core wafer clamping device in the field of semiconductor manufacturing, with electrostatic adsorption as its fundamental principle. It forms an electrostatic field by applying a high voltage and achieves non-contact fixation of wafers through Coulomb force or Johnson-Rahbek force, serving as an indispensable key component in vacuum processes such as plasma etching, ion implantation and thin film deposition. This product is adapted to harsh process environments including non-magnetic conditions and ultra-high vacuum of 10⁻⁵ Pa and below, and can stably adsorb various dielectric materials such as wafers, sapphire and glass. It supports customized designs of bipolar, multipolar and interdigitated electrodes, with the global flatness accuracy of the adsorption surface reaching within 1μm and parallelism better than 5μm. The adsorption force is ≥10N under the standard adsorption voltage, and the residual adsorption force remains above 60% for 24 hours, enabling the maintenance of a stable clamping effect for an extended period. In terms of structure and performance, the ESC Electrostatic Chuck is coated with high thermal conductivity ceramic films such as aluminum nitride and silicon nitride, which combines excellent plasma corrosion resistance and mechanical s...
Analysis Of Technical Advantages And Industrial Applications Of ESC Electrostatic Chucks
2026-01-23
As a new type of precision clamping technology replacing traditional mechanical clamping and vacuum adsorption, ESC Electrostatic Chucks have been applied on a large scale in various high-end manufacturing fields such as semiconductors, panel displays, solar photovoltaics and precision optics by virtue of their unique technical advantages, and have become the core carrier for modern ultra-clean thin sheet processing. Compared with traditional clamping methods, the core technical advantages of ESC Electrostatic Chucks are reflected in four major aspects. First, non-contact and stress-free clamping: Fixation is achieved by electrostatic force without physical contact, which completely avoids wafer damage and edge exclusion effect caused by mechanical fixtures, and is suitable for the processing of ultra-thin wafers with a thickness of less than 50μm and brittle semiconductor materials such as GaN and SiC. Second, full environmental adaptability: It can work stably under various working conditions such as atmospheric pressure, ultra-high vacuum and plasma, and can adsorb conductors, semiconductors, insulators and porous materials, with an extremely wide scope of application. Third, low consumption and high cleanliness: The energy consumption of electrostatic adsorption is much lower than that of...
Working Principle Of ESC Electrostatic Chuck
2026-01-23
The core of an ESC Electrostatic Chuck is to achieve non-contact and precise fixation of thin workpieces such as wafers and glass substrates by virtue of electrostatic induction and electric field force. In essence, it is a controllable capacitive adsorption system, suitable for harsh semiconductor working conditions such as vacuum and plasma environments. Meanwhile, it adapts to various process requirements through different adsorption mechanisms. It features a sandwich-like structure: the bottom layer is a base plate for support and circuit integration, the middle layer consists of metal electrodes (unipolar, bipolar or multipolar), and the surface layer is covered with an insulating and thermally conductive dielectric layer made of materials such as aluminum nitride and aluminum oxide. During operation, the workpiece acts as the upper plate of a capacitor, the built-in electrode as the lower plate, and the dielectric layer as the insulating medium, forming a complete capacitive structure that lays the foundation for electric field generation. In practical applications, the adsorption force is mainly derived from three mechanisms, each adapted to the needs of different scenarios. First is Coulomb force adsorption, applicable to ideal insulating dielectric layers. When a high-voltage DC voltage i...
What Factors Affect The Adsorption Force Of ESC Electrostatic Chucks?
2026-01-23
The core factors influencing the adsorption force of ESC Electrostatic Chucks can be categorized into four types: material characteristics, structural parameters, operating parameters and working environment. These factors are interrelated and directly determine the stability, uniformity and adaptability of adsorption, with a detailed analysis as follows: 1. Material Characteristics Materials form the fundamental guarantee for adsorption force, and their core impact lies in the effect of charge conduction and electric field formation. Dielectric layer material and performance The dielectric constant and volume resistivity of the dielectric layer directly determine the adsorption mechanism and the magnitude of adsorption force. A higher dielectric constant results in a stronger electric field and greater adsorption force (especially Coulomb force); aluminum nitride ceramics have a higher dielectric constant than aluminum oxide and deliver better adsorption performance. The volume resistivity must be precisely matched to the adsorption mechanism: for J-R force chucks, it should be controlled within the range of 10⁹–10¹²Ω·cm. Excessively high resistivity will make the chuck tend to exhibit Coulomb force characteristics (weak adsorption force and high voltage requirement...
How To Improve The Stability And Safety Of ESC Electrostatic Chucks
2026-01-23
To enhance the stability and safety of ESC Electrostatic Chucks, a full-process guarantee system must be established from four dimensions: operation control, daily maintenance, structural optimization and environmental adaptation. This system ensures the sustained stability of adsorption performance, the safety protection of operations, workpieces and equipment, and avoids potential risks such as charge accumulation and material wear. 1. Precisely Control Operating Parameters to Consolidate the Core of Stability Rational regulation of operating parameters is the foundation for maintaining adsorption stability and avoiding potential safety hazards, which must be set accurately in combination with adsorption mechanisms and process scenarios. Precise Matching of Voltage Parameters Set the rated voltage according to the chuck type (Coulomb force / J-R force) and strictly prohibit overvoltage operation — the Coulomb force type is controlled within 3000-4000V, and the J-R force type is limited to 500-800V to avoid dielectric layer breakdown and excessive charge accumulation. Equip with a voltage monitoring module to feed back voltage fluctuations in real time (allowable deviation ±5%), and automatically cut off the power when fluctuations exceed the limit to prevent abrupt changes in adso...
Product Characteristics And Core Classification Of VAT Vacuum Valves
2026-01-23
VAT Vacuum Valves are key components for zone isolation and airflow control in vacuum systems, specially designed for various vacuum working conditions covering high vacuum, ultra-high vacuum and extreme vacuum environments. With sophisticated design and stable performance, they have become core components of vacuum systems in fields such as precision manufacturing and scientific research experiments. As a professional vacuum valve brand originating from Switzerland, VAT has always focused on component reliability and working condition adaptability to build a product system that meets stringent process requirements. The core characteristics of VAT Vacuum Valves are reflected in multiple aspects. Valve bodies are mostly made of corrosion-resistant materials such as stainless steel and aluminum alloy, and some models are coated with special layers, which can resist erosion from corrosive and toxic process gases and adapt to different temperature working conditions. Certain products can withstand high temperatures above 400°C, meeting the needs of special scenarios such as vacuum furnaces and thin film deposition. Sealing performance is one of its core advantages: optimized through metal sealing or elastomeric sealing technology, the leak rate can be as low as 10⁻¹² mbar·L/s, whic...
Technical Advantages And Industry Application Scenarios Of VAT Vacuum Valves
2026-01-23
With differentiated technical design and full-scenario adaptability, VAT Vacuum Valves play a pivotal role in vacuum systems across various industries. Their technical advantages are reflected not only in basic performance, but also in customized solutions developed for pain points of different processes, while ensuring both system stability and long service life. In terms of technical design, VAT Vacuum Valves enhance comprehensive performance through a number of patented technologies. The motion curve control technology optimizes the valve's opening and closing rhythm, slowing down the speed near the closing point to reduce vibration and impact, avoid generating extra particles and protect sensitive process environments. The sealing structure is optimized in a targeted manner, and the sealing method is selected based on material characteristics and process requirements, which not only ensures air tightness when closed, but also reduces wear of sealing parts and extends the service life of components. The integration of an intelligent control module is one of the technical highlights: through the linkage of sensors and PLC control systems, it can monitor the valve's operating status in real time, support remote control and automated integration, and adapt to the operational needs of modern...
What Are The Application Scenarios Of DuPont Kalrez O-rings?
2026-01-23
DuPont Kalrez O-rings are suitable for harsh working conditions across various industries by virtue of their chemical corrosion resistance, wide temperature range adaptability and low contamination characteristics. They play a pivotal role especially in key processes requiring long-term stable sealing and avoidance of contamination and leakage risks. Their specific application scenarios are as follows: 1. Semiconductor Manufacturing As a core sealing component for semiconductor processes, Kalrez O-rings are adaptable to various plasma processes and vacuum environments, covering all key links in the entire chip manufacturing process. In deposition processes, for scenarios such as High-Density Plasma Chemical Vapor Deposition (HDPCVD), Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Atomic Layer Deposition (ALD), they can withstand process gases including TMS, TEOS, NF₃ and O₂ as well as high-temperature environments (250℃ to 310℃). Certain grades such as Kalrez® 9600 feature low erosion and low weight loss, meeting the requirements of high-purity vacuum applications, reducing particle generation and outgassing, and ensuring wafer processing quality. In etching and ashing processes—whether conductor etching (150℃ to 225℃, in contact with media such as CF₄ and HBr), dielectric etching...
What Is The Chemical Corrosion Resistance Of Kalrez O-rings?
2026-01-23
Wide range of chemical resistance Kalrez O-rings can resist more than 1,800 types of chemicals, including strong acids (e.g., concentrated nitric acid), strong alkalis (e.g., sodium hydroxide), organic solvents (e.g., toluene, acetone, dichloromethane), ethers, ketones, esters, benzene ring solvents, strong oxidants, amine compounds, fuels, oils and greases, etc. Its perfluoro main chain structure has no active reaction sites, fundamentally eliminating the possibility of corrosion failure. Verification of chemical corrosion resistance Swelling test: After 6 months of immersion in a mixed solution of toluene, acetone and dichloromethane, Kalrez O-rings show almost no volume change, while other rubbers undergo severe deformation. Comparative test: When Kalrez and fluororubber are immersed in organic media such as acetone and toluene, fluororubber swells significantly after 16 minutes, whereas Kalrez remains stable. Advantages in chemical corrosion resistance Far superior corrosion resistance to ordinary rubbers: Kalrez can maintain its sealing performance even in extreme chemical environments, while ordinary rubbers may suffer from volume expansion and sealing failure due to molecular chain breakage or cross-linked structure damage. Better corrosion resistance than other perfluoroelastomers: K...
Slit Valve Door - Structural Principle And Core Characteristics
2026-01-23
The slit valve door is a special component for cavity isolation and on-off control in vacuum systems. Named for its adaptation to the rectangular "transfer slit" opening between the transfer cavity and the process cavity, it falls into the category of gate-driven isolation valves. With its compact structure and reliable sealing performance, it has become a key component of vacuum systems in high-end manufacturing and scientific research fields. Its core design is developed around the sealing and isolation requirements of vacuum environments, taking into account opening-closing response and cleanliness control, and is suitable for a variety of harsh working conditions. In terms of working principle, the slit valve door realizes the on-off of the flow path through the linear movement of the gate plate, forming an isolation barrier between cavities. In the closed state, the gate plate is closely attached to the valve seat, and the gas flow is blocked by structural pressure and the characteristics of sealing parts to maintain the vacuum state inside the cavity. In the open state, the gate plate rises and falls vertically to the top of the valve cavity, making the flow path fully unobstructed and providing a channel for the transfer of workpieces such as wafers and substrates or gas circulatio...
