Key advantages of electrostatic chucks include:
Non-contact gripping: ESCs hold wafers from the backside, avoiding contact with sensitive top surfaces and preventing damage to nanostructures or patterns.
Uniform pressure distribution: This ensures consistent wafer flatness, critical for precise etching and deposition.
Reduced contamination: Absence of mechanical parts in contact minimizes particle generation.
Temperature control: Many ESCs integrate cooling or heating elements to maintain wafer temperature within ±1°C, crucial for process stability.
