|
Holding Force Degradation |
Electrode aging or surface contamination reduces adhesion over time. |
Plasma cleaning, regular surface treatment, and maintenance. |
|
Electrostatic Discharge (ESD) Risk |
High voltage may cause discharge, damaging wafers or equipment. |
Multi-layer insulation, ESD suppression circuits. |
|
Temperature Non-uniformity |
Uneven cooling or ceramic thermal conductivity causes process inconsistencies. |
Use high thermal conductivity ceramics (AlN), precise He pressure control. |
|
Deposition Contamination |
Process residues accumulate, degrading adsorption capability. |
In-situ plasma cleaning, routine maintenance after set wafer counts. |
